Thermal chemistry of the Cu-KI5 atomic layer deposition precursor on a copper surface
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چکیده
منابع مشابه
Surface Chemistry of Copper(I) Acetamidinates in Connection with Atomic Layer Deposition (ALD) Processes
Given the high stability of amidines, they have long been considered good choices as bidentate ligands in organometallic compounds. Early uses of metal amidinates have been reported in catalysis to promote polymerizations and other related reactions. 3 More recently, metal amidinates have been developed as promising precursors for the deposition of solid thin films. 8 They have proven particula...
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We report a method for producing thin, completely continuous and highly conductive copper films conformally inside very narrow holes with aspect ratios over 35:1 by atomic layer deposition ALD . Pure copper thin films were grown from a novel copper I amidinate precursor, copper I N,N -di-sec-butylacetamidinate, and molecular hydrogen gas as the reducing agent. This copper precursor is a liquid ...
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The initial surface chemistry and growth mechanisms of the atomic layer deposition (ALD) of metallic copper on SiO(2) surfaces are investigated using an amidinate precursor (copper(I) di-sec-butylacetamidinate, [Cu((s)Bu-amd)](2)) and molecular hydrogen. Using in situ Fourier transform infrared spectroscopy together with calculations based on density functional theory, we show that the initial ...
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22 Abstract 23 24 Surface chemistry and film growth were examined during titanium nitride (TiN) atomic layer deposition (ALD) using sequential 25 exposures of tetrakis-dimethylamino titanium (TDMAT) and NH . This ALD system is shown to be far from ideal and illustrates 3 26 many potential problems that may affect ALD processing. These studies were performed using in situ Fourier transform infra...
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ژورنال
عنوان ژورنال: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
سال: 2015
ISSN: 0734-2101,1520-8559
DOI: 10.1116/1.4896940